{"id":26,"date":"2021-05-12T23:20:21","date_gmt":"2021-05-12T15:20:21","guid":{"rendered":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/?page_id=26"},"modified":"2026-04-08T23:26:15","modified_gmt":"2026-04-08T15:26:15","slug":"publications","status":"publish","type":"page","link":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/publications\/","title":{"rendered":"Publications"},"content":{"rendered":"\n
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Invited Talks<\/a><\/div>\n\n\n\n
Book<\/a><\/div>\n\n\n\n
Journal<\/a><\/div>\n\n\n\n
Conference<\/a><\/div>\n\n\n\n
Workshop<\/a><\/div>\n\n\n\n
White Paper<\/a><\/div>\n\n\n\n
Dissertation<\/a><\/div>\n<\/div>\n\n\n\n

DISCLAIM: <\/strong>Copyright and all rights therein are retained by authors or other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without explicit permission of the copyright holder.<\/code><\/span><\/a><\/h4>\n\n\n\n

Book\/Book Chapters<\/span><\/h4>\n\n\n\n
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[B3] X. Guo<\/strong>, R. Wang, F. Hu, X. Wu, \u201cAI-Powered Vehicles: Computing Power and Chips for Intelligent Driving\u201d, ISBN 9787111799894, China Mechanical Industry Press, 2026. (In Chinese)
[B2] X. Guo<\/strong>*, L. Zhu, Y. Cai, \u201cHarnessing Graph Learning for Efficient Timing Signoff\u201d, in AI-Enabled Electronic Circuit and System Design: From Ideation to Utilization, ISBN 9783031714351, Springer Nature, 2025. (link<\/a>)
[B1] X. Guo<\/strong>*, M. R. Stan, “Circadian Rhythms for Future Resilient Electronic Systems – Accelerated Active Self- Healing for Integrated Circuits,” Springer, 2020. (link<\/a>) (Amazon<\/a>)<\/p>\n\n\n\n

<\/a>Journals<\/span><\/h4>\n\n\n\n
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[J17] X. Zhao\u22c4, Y. Wang\u22c4, Z. Li, Y. Li, Y. Pan, X. Guo*<\/strong>, \u201cAn EDA Physical Design Rectilinear Floorplan Benchmark Dataset (R-Zoo)\u201d, Accepted by IEEE Data Descriptions (IEEE-DATA<\/strong>), To appear. (\u22c4: Equal Contributions)
[J16] X. Zhao, Z. Li, Y. Cai, J. Chen, Y. Pan, X. Guo*<\/strong>, \u201cDARE: Enriching Physical Dataflow Awareness for Macro Placement Optimization\u201d, Accepted by ACM Transactions on Design Automation of Electronic Systems (TODAES<\/strong>), To appear.
[J15] Y. Su, Y. Wang*<\/strong>, Y. Pan, N. Xiang, H. Zhang, Y. Chen, Z. Xu, J. Smith, X. Guo*<\/strong>, \u201cAlgorithm-Hardware Co-Design of Binary Neural Network for Efficient Super Resolution on FPGA\u201d, Accepted by Integration, the VLSI Journal, To appear.
[J14] K. Cheah, F. Q. Chua, Y. Zhang, Y. Ji, Y. Zhang, X. Guo<\/strong>, H. Ramiah, and Y. Li, \u201cA Corpus Of Synthesizable Verilog RTL Modules Dataset for EDA Research (CORE)\u201d, Accepted by IEEE Data Descriptions (IEEE-DATA<\/strong>), To appear. (link<\/a>)
[J13] Y. Ouyang, Y. Liang, Q. Li, X. Guo<\/strong>, Y. Luo, D. Wu, H. Wang, Y. Pan, “Back to fundamentals: Low-level visual features guided progressive token pruning”, Accepted by Journal of Systems Architecture (JSA<\/strong>), Volume 168, November 2025. (link<\/a>)
[J12] R. Wang, Z. Wang, T. Lin, J. Raby, M. Stan, X. Guo*<\/strong>, \u201cCool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs\u201d, Accepted by IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS<\/strong>), To appear. (link<\/a>)
[J11] X. He, Y. Pan, Z. Xu, Z. Li, X. Guo<\/strong>, C. Yang, “AL-HCL: Active Learning and Hierarchical Contrastive Learning for Multimodal Sentiment Analysis with Fusion Guidance”, Accepted by IEEE Transactions on Affective Computing (TAC<\/strong>), To appear. (link<\/a>)
[J10] X. He, Y. Pan, X. Guo<\/strong>, Z. Xu, C. Yang, \u201cScale-Selectable Global Information and Discrepancy Learning Network for Multimodal Sentiment Analysis and Depression Detection\u201d, Accepted by IEEE Transactions on Affective Computing (TAC<\/strong>), To appear. (link<\/a>)
[J9] X. Zhao, R. Xu, Y. Gao, V. Verma, M. Stan, X. Guo<\/strong>*, “Edge-MPQ: Layer-Wise Mixed-Precision Quantization with Tightly Integrated Versatile Inference Units for Edge Computing”, IEEE Transactions on Computers (TC<\/strong>), 2024, To appear. (link<\/a>)
[J8] J. Shaik, X. Guo*,<\/strong> S. Singhal, \u201cImpact of Aging and Process Variability on SRAM-based In-Memory Computing Architectures\u201d, IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I<\/strong>), 2024, To appear. (link<\/a>)
[J7] X. Guo<\/strong>*, \u201cActive Accelerated Recovery for Combating Chip Aging Issues – Opportunities and Challenges\u201d, Journal of Electronics & Information Technology, vol. 45, no. 11, pp. 1-12, 2023. (Invited paper) (In Chinese) (Featured Article)
[J6] M. El-Hadedy\u22c4*, X. Guo<\/strong>\u22c4*, K. Yoshii, Y. Cai, R. Herndona, B. Bantaa, W. Hwu, \u201cRECO-ASCON: Reconfigurable ASCON Hash Functions for IoT Applications\u201d, Integration, the VLSI Journal, vol. 93, pp. 102061, 2023. (\u22c4 Equal contributions)
[J5] X. Guo<\/strong>*, M. El-Hadedy, S. Mosanu, X. Wei, K. Skadron, M. Stan, “Agile-AES: Implementation of Configurable AES Primitive with Agile Design Approach”, Accepted by Integration, the VLSI Journal<\/em>, 2022. (link<\/a>)
[J4] P. Guerrero, T. Tracy II, X. Guo<\/strong>, M. Lenjani, K. Skadron and M. Stan, “Towards on-node machine learning for ultra-low-power sensors using asynchronous Sigma Delta streams,” ACM Journal on Emerging Technologies in Computing Systems (JETC<\/strong>)<\/em>, Vol. 16, No. 4, Article 44 , doi.org\/10.1145\/3404975, 2020. (link<\/a>)
[J3] X. Guo<\/strong>, V. Verma, P. Guerrero, S. Mosanu, M. Stan, “Back to the Future: Digital Circuit Design in the FinFET Era,” Journal of Low Power Electronics (JOLPE<\/strong>)<\/em>, Vol. 13, No. 3, pp. 338\u2013355, DOI 10.1166\/jolpe.2017.1489, September 2017. (Invited Paper<\/strong>) (link<\/a>) (Invited Talk video<\/a>)
[J2] X. Guo<\/strong>, M. Stan, “Implications of Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience”, INTEGRATION, the VLSI journal<\/em>, DOI 10.1016\/j.vlsi.2016.10.008, vol. 56, pp. 167-180, 2017. (pdf<\/a>)
[J1] M. El-Hadedy, X. Guo<\/strong>, M. Margala, M. Stan, K. Skadron, “Dual-Data Rate Transpose-Memory Architecture Improves the Performance, Power and Area of Signal-Processing Systems.” Journal of Signal Processing Systems (JSPS<\/strong>), <\/em>DOI 10.1007\/s11265-016-1199-1<\/a><\/span>, <\/em>(2016): 1-18. <\/em>(pdf<\/a><\/span>)<\/span><\/p>\n<\/div>\n<\/div>\n\n\n\n

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Conferences<\/span><\/h4>\n\n\n\n
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[C46] Z. Li\u22c4, K. Tian\u22c4, F. Hu, Z. Li, X. Wu, H. Zhang, S. Chen, J. Zhai*, X. Guo<\/strong>*, K. Zhao, \u201cChiPlanner: Physically-Aware and Timing-Driven Design Planner for 2.5D Multi-Chiplet Systems\u201d, Accepted by ACM\/IEEE Design Automation Conference (DAC<\/strong>), Long Beach, USA, July 2026. (\u22c4 Equal contributions)
[C45] L. Zhu, T. Tseng, Y. Pan, Q. He, X. Guo*<\/strong>, \u201cCircuitS2L: Circuit Dataset Augmentation via Generative Featuring and Supervised Labeling\u201d, Accepted by IEEE International Symposium on Circuits & Systems (ISCAS<\/strong>), Shanghai, China, May 2026.
[C44] Z. Ning, J. Shao, R. Xu, X. Guo<\/strong>, J. Zhang, C. Zhang, X. Li, “CAS-Spec: Cascade Adaptive Self-Speculative Decoding for On-the-Fly Lossless Inference Acceleration of LLMs”, Accepted by The Thirty-ninth Annual Conference on Neural Information Processing Systems (NeurIPS<\/strong>), San Diego, United States, December 2025.
[C43] C. Che, Y. Jiang, X. Guo<\/strong>*, K. Lei*, R. Martins, P. Mak, \u201cA Linear-Regression-Assisted Trimming Scheme for CMOS Voltage Reference\u201d, Accepted by IEEE International Symposium on Circuits & Systems (ISCAS<\/strong>), London, United Kingdom, May 2025.
[C42] X. Zhao, J. Chen, Z. Li, Y. Cai, X. Guo*<\/strong>, \u201cIncreDFlip: Incremental Dataflow-Driven Macro Flipping for Efficient Macro Placement Refinement\u201d, Accepted by International Symposium of EDA (ISEDA<\/strong>), Hong Kong, China, May 2025.
[C41] X. Wu, X. Guo*<\/strong>, \u201cSketch-to-Style: Augmenting AI4EDA Dataset with Automatic Image Generative Framework\u201d, Accepted by International Symposium of EDA (ISEDA<\/strong>), Hong Kong, China, May 2025.
[C40] Y. Cai, L. Zhu, X. Guo<\/strong>*, \u201cRevisit MBFF: Efficient Early-Stage Multi-bit Flip-Flops Clustering with Physical and Timing Awareness\u201d, Accepted by Asia and South Pacific Design Automation Conference (ASPDAC<\/strong>), Tokyo, Japan, January 2025.
[C39] L. Zhu, X. Ma, S. Hao, Y. Pan, X. Guo<\/strong>*, \u201cElastic EDA: Auto-scaling Cloud Resources for EDA Tasks via Learning-based Approaches\u201d, Accepted by IEEE International Conference on Computer Design (ICCD<\/strong>), Milan, Italy, November 2024.
[C38] Y. Ouyang, W. Yang, H. Wang, Y. Pan*, X. Guo<\/strong>*, \u201cMEGA: A Multimodal EEG-Based Visual Fatigue Assessment System\u201d, Accepted by IEEE Biomedical Circuits and Systems (BIOCAS<\/strong>), Xi\u2019an, China, October 2024.
[C37] L. Zhu, Y. Cai, X. Guo<\/strong>*, \u201cOne-for-All: An Unified Learning-based Framework for Efficient Cross-Corner Timing Signoff\u201d, Accepted by ACM\/IEEE International Conference on Computer-Aided Design (ICCAD<\/strong>), New Jersey, USA, October 2024.
[C36] C. Morgul, X. Guo<\/strong>*, M. Stan*, \u201cUnveiling Proactive Recovery\u2019s Preventative Impact on NAND Flash Wearout\u201d, Accepted by IEEE Computer Society Annual Symposium on VLSI (ISVLSI<\/strong>), Knoxville, Tennessee, USA, July 2024.
[C35] R. Xu, Q. Duan, Q. Chen, X. Guo<\/strong>*, \u201cILD-MPQ: Learning-Free Mixed-Precision Quantization with Inter-Layer Dependency Awareness\u201d, Accepted by IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS<\/strong>), Abu Dhabi, UAE, April 2024.
[C34] R. Wang, R. Xu, X. Zhao, K. Jiang, X. Guo<\/strong>*, “CINEMA: A Configurable Binary Segmentation Based Arithmetic Module for Mixed-Precision In-Memory Acceleration”, Accepted by IEEE International Symposium on Circuits & Systems (ISCAS<\/strong>), Singapore, May 2024.
[C33] X. Zhao, T. Wang, R. Jiao, X. Guo*<\/strong>, “Standard Cells Do Matter: Uncovering Hidden Connections for High-Quality Macro Placement”, Accepted by Design, Automation and Test in Europe Conference (DATE<\/strong>), Valencia, Spain, March 2024.
[C32] L. Zhu, X. Guo<\/strong>*, \u201cDelay-Driven Physically-Aware Logic Synthesis with Informed Search\u201d, Accepted by 41st IEEE International Conference on Computer Design (ICCD<\/strong>), Washington DC, USA, November 2023.
[C31] R. Wang, J. Han, M. Stan, X. Guo<\/strong>*, \u201cHot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation\u201d, Accepted by 15th IEEE International Green and Sustainable Computing Conference (IGSC<\/strong>), co-located with MICRO 2023, Toronto, ON, Canada, October 2023.
[C30] Y. Gu, X. Wang, Z. Chen, C. Wu*, X. Guo<\/strong>*, J. Li, M. Guo, S. Wu, R. Yuan, T. Zhang, Y. Zhang, H. Cai, \u201cImproving Productivity and Efficiency of SSD Manufacturing Self-Test Process by Learning-based Proactive Defect Prediction\u201d, Accepted by IEEE International Test Conference (ITC<\/strong>), Anaheim, California, USA, October 2023.
[C29] Y. Gao, S. Mosanu, M. Sakib, V. Verma, X. Guo<\/strong>, M. Stan, \u201cLiteAIR5: A System-Level Framework for the Design and Modeling of AI-Extended RISC-V Cores\u201d, 36th IEEE International System-on-Chip Conference (SOCC<\/strong>), Santa Clara, CA, USA, September 2023.
[C28] R. Wang, X. Guo<\/strong>*, \u201cA Hierarchically Reconfigurable SRAM-Based Compute-in-Memory Macro for Edge Computing\u201d, Accepted by International Conference on Artificial Intelligence Circuits and Systems (AICAS<\/strong>), Hangzhou, China, June 2023.
[C27] L. Zhu, Y. Gu, X. Guo<\/strong>*, \u201cRC-GNN: A Graph Neural Network Model for Fast and Accurate Signoff Wire Delay Estimation\u201d, Accepted by International Conference on Artificial Intelligence Circuits and Systems (AICAS<\/strong>), Hangzhou, China, June 2023.
[C26] X. Zhao, Y. Gao, V. Verma, R. Xu, M. Stan, X. Guo<\/strong>*, \u201cDesign Space Exploration of Layer-Wise Mixed-Precision Quantization with Tightly Integrated Edge Inference Units\u201d, ACM Great Lakes Symposium on VLSI (GLSVLSI<\/strong>), Knoxville, TN, USA, June 2023.
[C25] Y. Wei, S. Gong, H. Mei, L. Shi, X. Guo<\/strong>*, \u201cConvolutional Neural Networks on the Edge: A Comparison Between FPGA and GPU\u201d, China Semiconductor Technology International Conference (CSTIC<\/strong>), Shanghai, China, June 2023.
[C24] X. Zhao, R. Xu, X. Guo<\/strong>*, \u201cPost-training Quantization or Quantization-aware Training? That is the Question\u201d, China Semiconductor Technology International Conference (CSTIC<\/strong>), Shanghai, China, June 2023.
[C23] X. Wei, M. El-Hadedy, S. Masanu, Z. Zhu, W. Hwu, X. Guo<\/strong>*, \u201cRECO-HCON: A High-Throughput Reconfigurable Compact ASCON Processor for Trusted IoT\u201d, Accepted by IEEE International System-on-Chip Conference (SOCC<\/strong>), Belfast, Northern Ireland, September 2022. (Best Paper Award<\/strong>)
[C22] M. El-Hadedy\u22c4, X. Guo<\/strong>\u22c4*, \u201cReaLSE: Reconfigurable Lightweight Security Engines for Trusted Edge Devices\u201d, Accepted by IEEE 4th International Conference on Circuits and Systems (ICCS<\/strong>), Chengdu, China, September 2022. (\u22c4 Equal contributions) (Best Oral Presentation Award<\/strong>)
[C21] M. Morgul, M. Stan, X. Guo<\/strong>*, \u201cScheduling Active and Accelerated Recovery to Combat Aging in Integrated Circuits\u201d, IEEE International Midwest Symposium on Circuits and Systems (MWSCAS<\/strong>), Virtual, August 2022. (Invited paper<\/strong>)
[C20] M. Morgul, X. Guo<\/strong>, M. Stan, \u201cTowards Everlasting Flash: Preventing Permanent Flash Cell Damage using Circadian Rhythms\u201d, Accepted by IEEE Computer Society Annual Symposium on VLSI (ISVLSI<\/strong>), Pafos, Cyprus, July 2022.
[C19] J. Han, X. Guo<\/strong>, K. Skadron, M. Stan, \u201cFrom 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0\u201d, accepted by The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE ITherm<\/strong><\/em>), San Diego, USA, June 2022.
[C18] X. Wei, X. Guo<\/strong>*, \u201cBeyond Verilog: Evaluating Chisel versus High-level Synthesis with Tiny Designs\u201d, International Symposium on Quality Electronic Design (ISQED<\/strong><\/em>), Virtual, April 2022.
[C17] X. Guo<\/strong>*, \u201cDesign-for-Recovery Techniques for Combating Chip Aging Issues\u201d, China Semiconductor Technology International Conference (CSTIC<\/strong><\/em>), Shanghai, China, June 2022.
[C16] M. El-Hadedy, X. Guo<\/strong>, W. Hsu, K. Skadron, “Edge Crypt-Pi: Securing Internet of Things with Light and Fast Crypto-Processor,” Proc. of the Future Technologies Conference (FTC<\/strong>)<\/em>, Vancouver, Canada, November 2020. (pdf<\/a><\/span>)
[C15] P. Guerrero, T. Tracy, X. Guo<\/strong>, M. Stan, “Towards low-power machine learning using asynchronous computing with streams,” Proc. of International Green and Sustainable Computing Conference<\/em> (IGSC<\/strong><\/em>), Alexandria, Virginia, October 2019. (pdf<\/a><\/span>)
[C14] P. Guerrero, X. Guo<\/strong>, M. Stan, “ASC-FFT: Area-efficient low-latency FFT design based on asynchronous stochastic computing,” Proc. of IEEE Latin American Symposium on Circuits and Systems<\/em> (LASCAS<\/strong><\/em>), Armenia, Quind\u00edo, Colombia, February 2019. (Best Paper Award) <\/strong>(pdf<\/a><\/span>)
[C13] S. Mosanu, X. Guo<\/strong>, M. El-Hadedy, L. Anghel, M. Stan, “Flexi-AES: A Highly-Parameterizable Cipher for a Wide Range of Design Constraints”, Proc. of IEEE International Symposium On Field-Programmable Custom Computing Machines <\/span><\/em>(FCCM<\/strong><\/em>), San Diego, CA, April 2019. (pdf<\/a><\/span>)
[C12] P. Guerrero, X. Guo<\/strong>, M. Stan, “SC-SD: Towards Low Power Stochastic Computing on Sigma Delta Streams,” IEEE International Conference on Rebooting Computing (ICRC<\/strong>)<\/em>, Tysons, VA, November 2018. (Video<\/a><\/span>)(pdf<\/a><\/span>)<\/span>
[C11] A. Roelke, X. Guo<\/strong>, M. Stan, “OldSpot: A Pre-RTL Model for Fine-grained Aging and Lifetime Optimization,” IEEE International Conference on Computer Design (ICCD<\/strong>)<\/em>, Orlando, FL, October 2018. (pdf<\/a><\/span>) (Github<\/strong><\/a><\/span>)
[C10] X. Guo<\/strong>, V. Verma, P. Guerrero and M. Stan, “When “things” get older – Exploring Circuit Aging in IoT Applications”, International Symposium on Quality Electronic Design (ISQED<\/strong>)<\/em>, Santa Clara, CA, March 2018. (pdf<\/a><\/span>) (link<\/a><\/span>)<\/span>
[C9] D. Kamakshi, X. Guo<\/strong>, H. Patel, M. Stan and B. Calhoun, “A Post-Silicon Hold Time Closure Technique using Data-Path Tunable-Buffers for Variation-Tolerance in Sub-threshold Designs”, International Symposium on Quality Electronic Design (ISQED<\/strong>)<\/em>, Santa Clara, CA, March 2018. (pdf<\/a><\/span>) (link<\/a><\/span>)
[C8] S. Eldridge, V. Verma, X. Guo<\/strong>, A. Roelke, K. Swaminathan, N. Chandramoorthy, M. Cochet, A. Buyuktosunoglu, C. Vezyrtzis, R. Joshi, M. Ziegler, M. Stan, P. Bose, \u201cVELOUR – Very Low Voltage Operation Under Resilience Constraints,\u201d The Government Microcircuit Applications and Critical Technology Conference (GOMACTech<\/strong>), Miami, FL, March 2018.
[C7] X. Guo<\/strong>, M. Stan, “Deep Healing: Ease the BTI and EM Wearout Crisis by Activating Recovery,” Proc. of IEEE\/IFIP International Conference on Dependable Systems and Networks (DSN<\/strong>), <\/em>Denver, CO, June 2017. <\/em>(pdf<\/a><\/span>) 
[C6] M. El-Hadedy, X. Guo<\/strong>, M. Stan, K. Skadron, “PPE-ARX: Area- and Power-Efficient VLIW Programmable Processing Element for IoT Crypto-Systems,” Proc. of NASA\/ESA Conference on Adaptive Hardware and Systems (AHS<\/strong>), <\/em>Pasadena, CA, July 2017. (pdf<\/a><\/span>)<\/span>
[C5] X. Guo<\/strong>, M. Stan, “Deep Healing: Ease the BTI and EM Wearout Crisis by Activating Recovery,” Proc. of 13th IEEE Workshop on Silicon Errors in Logic\u2013System Effects (SELSE-13<\/strong>)<\/em>, Boston, MA, March 2017. (Best Paper Award) <\/strong>(pdf<\/a><\/span>)
[C4] X. Guo<\/strong>, M. Stan, “Work hard, sleep well – Avoid irreversible IC wearout with proactive rejuvenation,” Proc. of the ACM\/IEEE Asia and South Pacific Design Automation Conference (ASP-DAC<\/strong>)<\/em>, Macau, China, January 2016. (Acceptance Rate: 94\/274 = 34.3%) (pdf<\/a><\/span>) (slides<\/a><\/span>)
[C3] X. Guo<\/strong>, M. Stan, “MCPENS: Multiple-Critical-Path Embeddable NBTI Sensors for Dynamic Wearout Management,” Proc. of 11th IEEE Workshop on Silicon Errors in Logic\u2013System Effects (SELSE-11<\/strong>), <\/em>pp. 116-121, Austin, TX, April 2015. (pdf<\/a><\/span>) (slides<\/a><\/span>)
[C2] X. Guo<\/strong>, W. Burleson, M. Stan, “Modeling and Experimental Demonstration of Accelerated Self-Healing Techniques,” In Proc. of ACM\/IEEE Design Automation Conference (DAC<\/strong>)<\/em>, San Francisco, CA, June 2014. (Acceptance Rate: 174\/787 = 22%) (pdf<\/a><\/span>) (.ppt<\/a><\/span>) (poster<\/a><\/span>)
[C1] Y. Zhao, Y. Yang, K. Mazumdar, X. Guo<\/strong>, M.R. Stan, “A Multi-Output on-Chip Switched-Capacitor DC-DC Converter for Near- and Subthreshold Power Modes,” In Proc. of IEEE International Symposium on Circuits and Systems (ISCAS<\/strong>)<\/em>, Melbourne, Australia, June 2014. (pdf<\/a><\/span>) (.ppt<\/a><\/span>)<\/span><\/p>\n<\/div>\n<\/div>\n\n\n\n

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Invited Talks<\/span><\/h4>\n\n\n\n
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[T11] \u201cShift-Left in EDA: From Architecture to Signoff\u201d at Huawei-Fudan Semiconductor Technology Forum, Shanghai, China, December 2022.
[T10] \u201cSoC Design in the Era of AI: Architecture, EDA and Packaging\u201d at Aijishu Open Course, Virtual, China, August 2022. (Recording<\/a>)
[T9] \u201cEDA Challenges in the \u201cShift-Left\u201d Regime\u201d, at Huawei Shanghai Research Center, Virtual, China, August 2022.
[T8] \u201cVitis-AI Powered Intramuscular Site Detection for Autonomous Injection\u201d at Zhidongxi Open Course – AMD-Xilinx joint event, Virtual, China, June 2022. (Recordings<\/a>)
[T7] Chip Design in the 21st Century: The Intersection of Everything\u201d at UM-SJTU JI\/GIFT Graduate Student Seminar, Shanghai, China, May 2022.
[T6] \u201cShift Left: A Designer\u2019s Perspective\u201d at Huawei Strategy and Technology Workshop (STW), Shenzhen, China, October 2021.
[T5] \u201cCross-layer Co-design for Resilient Hardware\u201d at Boston (and Beyond) Area Architecture Workshop (BARC),Online, January 2021.
[T4] \u201cHigh Speed and Low Power SoC Design and EDA Challenges\u201d at UM-SJTU Joint Institute International Symposium for Young Investigators, Online, June 2020.
[T3] \u201cReliable and Low Power Digital Circuits and Systems\u201d at IMEC, Online, January 2018.
[T2] \u201cTowards Wearout-aware and Accelerated Self-Healing Digital Systems,\u201d at Ayar Lab, San Francisco, CA, October 2017.
[T1] \u201cTowards Wearout-aware and Accelerated Self-Healing Digital Systems,\u201d at Intel, Hillsboro, OR, December 2016.<\/span><\/p>\n<\/div>\n<\/div>\n\n\n\n

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Workshops<\/span><\/h4>\n\n\n\n
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[W18] R. Wang, X. Guo<\/strong>, \u201cA Multi-Functional SRAM-Based Compute-in-Memory Macro on the Edge\u201d, Semiconductor Technology Forum 2022, Shanghai, December 2022. (Best Paper Award<\/strong>)
[W17] X. Zhao, X. Guo<\/strong>, \u201cDAG-MP: Enabling High-Quality Macro Placement with Enhanced Dataflow-Aware Guidance\u201d, Semiconductor Technology Forum 2022, Shanghai, December 2022.
[W16] R. Wang, X. Guo<\/strong>, \u201cAn All-Digital Reconfigurable SRAM-Based Compute-in-Memory Macro for TinyML Devices\u201d, TinyML Asia<\/strong>, Virtual, November 2022.
[W15] X. Zhao, V. Verma, Y. Gao, R. Xu, M. Stan, X. Guo<\/strong>, \u201cTILE-MPQ: Design Space Exploration of Tightly Integrated Layer-WisE Mixed-Precision Quantized Units for TinyML Inference\u201d, TinyML Asia<\/strong>, Virtual, November 2022.
[W14] X. Guo<\/strong>, X. Zhao, V. Verma, M. Stan, \u201cExtending RISC-V ISA for Tightly Integrated Inference at the Edge\u201d, RISC-V Summit China 2022 (RVSC2022<\/strong>), Virtual, August 2022. (Recording)
[W13] M. Stan, K. Skadron, X. Guo<\/strong>, J. Han, \u201cHotSpot Through the Ages\u201d, HotSpots Strike Back Workshop (HSSB<\/strong>), co-located with International Symposium on Computer Architecture (ISCA), New York, NY, June 2022.
[W12] R. Wang, Y. Gu, X. Guo<\/strong>, \u201cJ-Eye: Intramuscular Site Detection for Autonomous Injection using Vitis AI\u201d, Accepted by IEEE International NEWCAS Conference (NEWCAS<\/strong>) Student Workshop, Quebec, Canada, June 2022.
[W11] M. Morgul, X. Guo<\/strong>, M. Stan, \u201cCircadian Rhythm: A Candidate for Achieving Everlasting Flash Memories\u201d, Proceeding of the 13th Annual Non-Volatile Memories Workshop (NVMW<\/strong>), San Diego, CA, May 2022.
[W10] X. Guo, \u201cCross-layer Codesign for Resilient Hardware\u201d, Boston (and Beyond) Area Architecture Workshop (BARC<\/strong>), Online, January 2021.<\/span>
[W9] S. Mosanu, X. Guo<\/strong>, M. El-Hadedy, L. Anghel, M. Stan, “AES and SHA Cryptography Library for Chisel,” Chisel Community Conference <\/em>(CCC<\/strong><\/em>), Berkeley, CA, November 2018. (Youtube<\/a><\/span>) (Github<\/strong><\/a><\/span>)
[W8] V. Verma, X. Guo<\/strong>, M. Stan, “Low-Power Design with Open-Source Hardware: Opportunities and Challenges,” Workshop on Open-Source EDA Technology (WOSET<\/strong>)<\/em>, co-located with ICCAD, San Diego, CA, November 2018. (link<\/a><\/span>) (pdf<\/a><\/span>)
[W7] M. El-Hadedy, X. Guo<\/strong>, X. Huang, M. Margala, “RE-HASE: Regular-Expressions Hardware Synthesis Engine,” Third International Workshop on Heterogeneous High-performance Reconfigurable Computing<\/em> (H2RC’17)<\/strong>, in conjunction with SC<\/strong><\/em>, Denver, CO, November 2017. (pdf<\/a><\/span>) (slides<\/a><\/span>)
[W6] S. Eldridge, K. Swaminathan, N. Chandramoorty, A. Buyuktosunoglu, A. Roelke, X. Guo<\/strong>, V. Verma, R. Joshi, M. Stan, P. Bose, \u201cA low voltage RISC-V heterogeneous system: boosted SRAMs, machine learning and fault injection on VELOUR,” Workshop on Computer Architecture Research with RISC-V (CARRV<\/strong>)<\/em>, co-located with IEEE MICRO<\/strong><\/em>, Boston, MA, October 2017. (pdf<\/a><\/span>)
[W5] M. El-Hadedy, X. Guo<\/strong>, W. Hwu, M. Stan, K. Skadron, \u201cCrypt-Pi: A Light and Fast Crypto-Processor for IoT Applications,\u201d SRC TECHCON, Austin, TX, September 2017. (Best-in-Session Award<\/strong>)
[W4] M. El-Hadedy, X. Guo<\/strong>, M. Stan, K. Skadron, W. Hwu, \u201cR-NNPE: Reconfigurable Neural Network Processing Elements,\u201d SRC TECHCON, Austin, TX, September 2017.
[W3] D. Akella, X. Guo<\/strong>, M. Stan, B. H. Calhoun, \u201cEnabling Post-Silicon Hold Time Closure by Tunable-Buffer Insertion,\u201d Design Automation Conference (DAC), Work-in-Progress (WIP) Poster Session, Austin, TX, June 2017.
[W2] X. Guo<\/strong>, M. Stan, “Enabling Wearout-Immune BEOL and FEOL with Active Rejuvenation,” Proc. of the IEEE\/ACM Workshop on Variability Modeling and Characterization<\/em> (VMC<\/strong><\/em>), in conjunction with ICCAD<\/strong>, <\/em>Austin, TX, November 2016. (pdf<\/a><\/span>) (poster<\/a><\/span>) (link<\/a><\/span>)
[W1] X. Guo<\/strong>, M. Stan, \u201cTowards Wearout-Free Systems: A Self-Healing Strategy Enabled by Accelerated and Active Recovery,\u201d SRC TECHCON, Austin, TX, September 2016.<\/span><\/p>\n<\/div>\n<\/div>\n\n\n\n

<\/a><\/span><\/h4>\n\n\n\n

White Papers<\/span><\/h4>\n\n\n\n
\n\n\n\n
\n
\n

[WP] K. Mazumdar, X. Guo<\/strong>, R. Zhang, M. Stan, \u201cCharge-Recycled Power-Regulation with Stacked Loads and Stacked Switched-Capacitors\u201d.
[WP]  V. Verma, X. Guo<\/strong>, S. Mosanu, M. Das, Y. Chen, B. Ghaemmaghami, M. Stan, \u201cTowards Low-Power Open Source Hardware: Methodology, Design Techniques and Lessons”.<\/span><\/p>\n<\/div>\n<\/div>\n\n\n\n

<\/p>\n\n\n\n

Dissertations<\/span><\/h4>\n\n\n\n
\n\n\n\n

X. Guo, <\/strong>“Towards Wearout-Aware and Accelerated Self-Healing Digital Systems”, University of Virginia Library<\/em>, March 2018. (link<\/a><\/span>) (slides upon request)<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Book\/Book Chapters [B3] X. Guo, R. Wang, F. Hu, X. Wu, \u201cAI-Powered Vehicles: Computing Power and Chips for Intelligent Driving\u201d, ISBN 9787111799894, China Mechanical Industry Press, 2026. (In Chinese)[B2] X. Guo*, L. Zhu, Y. Cai, \u201cHarnessing Graph Learning for Efficient Timing Signoff\u201d, in AI-Enabled Electronic Circuit and System Design: From Ideation to Utilization, ISBN 9783031714351, […]<\/p>\n","protected":false},"author":31,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"no-sidebar","site-content-layout":"default","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"disabled","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-26","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/pages\/26","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/users\/31"}],"replies":[{"embeddable":true,"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/comments?post=26"}],"version-history":[{"count":97,"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/pages\/26\/revisions"}],"predecessor-version":[{"id":664,"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/pages\/26\/revisions\/664"}],"wp:attachment":[{"href":"https:\/\/sites.gc.sjtu.edu.cn\/xinfei-guo\/wp-json\/wp\/v2\/media?parent=26"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}